Wafer Measurement
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Our systems do these Wafer Measurements:
• Sawmarks
• TTV – Thickness
• Size, Surface, Chipping Edge Detection
• Contamination
• Detection and Identification
• Microcrystal Detection
The Sawmarks Measurement System measures wafers using a patent pending and unique shadow measurement technique, cancelling the effects of the crystal pattern. The operator can verify how the sawmarks develop over the wafer. Large sawmarks will often have a large gradient towards the edge of the wafer.
We are proud to present a combined Sawmarks and TTV Measurement System with a resolution of 1 micrometer.
The solutions are built on Scorpion Vision Software for user friendliness, configurability, reliability, flexibility and ease of maintenance. Off-the-shelf world class hardware components including area- and line-scan camera technology are used.